Journal

Article
The thermal-aging effect on the microstructure evolution and shear strength of the Sn-Rich Au-Sn soldering between AlTiC and Si substrate in microelectronics
Journal
Key Engineering Materials (9th International Conference on Materials Science and Technology, MSAT 2016) (ISSN: 16629795)
Volume
751
Issue
-
Year
สิงหาคม 2017
Page
3-8
Class
นานาชาติ
DOI
10.4028/www.scientific.net/KEM.751.3
Related Link
-